| 參數(shù)名稱 | 參數(shù)值 |
|---|---|
| Product Status | Active |
| Type | LGA |
| Number of Positions or Pins (Grid) | 3647 |
| Pitch - Mating | 0.039" (1.00mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0μin (0.76μm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.034" (0.86mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0μin (0.76μm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Thermoplastic |
| Operating Temperature | - |
新聞資訊
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