| 參數(shù)名稱 | 參數(shù)值 |
|---|---|
| Product Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C ~ 125°C |
新聞資訊
Samtec, Inc. IC插座 產(chǎn)品 ICF-308-T-I
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