| 參數(shù)名稱 | 參數(shù)值 |
|---|---|
| Product Status | Obsolete |
| Type | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 256 (21 x 21) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0μin (0.76μm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0μin (0.76μm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES) |
| Operating Temperature | -55°C ~ 150°C |
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